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Assembly Line

Physical Logic is happy to reveal its fully qualified in-house production assembly line capabilities.

With modern state of the art equipment we can assure efficiency, reliability and professionalism for all our customers.

Die bonding

The die attach process is a critical stage in MEMS accelerometers manufacturing chain., At first glance, die attach seems to be a simple process step, however for today’s applications, where MEMS accuracy competes with that of mechanical accelerometers, high standards of die bonding are key. Tight control and repeatability of the process and bonding material properties are essential requirements. Our die attach equipment is based on unique and innovative concepts advancing process quality and yielding economic benefits.

Wire bonding

Reliable wire-bonding is a critical operation enabling MEMS accelerometer resistance in to harsh environmental conditions.  To this end, a leading generation of assembly equipment offers MEMS accelerometers manufacturing leadership, setting new standards of performance, productivity, reliability, and ease of use.

Seam sealing:

Atmospheric controlled lid sealing of the MEMS accelerometer’s ceramic package is a key factor for ensuring long lifetime and stable long-term performance. Our Seam sealer offers a flexible process to meet the ever-increasing demands of lid placement and sealing applications. A computer-controlled precision tacking and seam sealing mechanism is combined with a high frequency inverter welding power supply and an optional high-resolution vision system to provide a robust and repeatable process.  The In-situ vacuum bake process followed by sealing in a controlled atmosphere glove box ensures the elimination of impurities which over time and under varied environmental conditions may compromise sensor reliability.