Assembly and Test Line

Physical Logic holds fully qualified in-house production assembly and test lines.

With modern state of the art equipment we can assure efficiency, reliability and professionalism for all our customers.

Die bonding

The die attach process is a critical stage in MEMS accelerometers manufacturing chain. For today’s applications, where MEMS accuracy competes with that of mechanical accelerometers, high standards of die bonding are key. Tight control and repeatability of the process and bonding material properties are essential requirements. Our die attach equipment is based on unique and innovative concepts advancing process quality and yielding economic benefits.

Wire bonding

Reliable wire-bonding is a critical operation enabling MEMS accelerometer resistance into harsh environmental conditions. To this end, a leading generation of assembly equipment offers MEMS accelerometers manufacturing leadership, setting new standards of performance, productivity, reliability, and ease of use.

Seam sealing

Atmospheric controlled lid sealing of the MEMS accelerometer’s ceramic package is a key factor for ensuring long lifetime and stable long-term performance. Our Seam sealer offers a flexible process to meet the ever-increasing demands of lid placement and sealing applications. The In-situ vacuum bake process followed by sealing in a controlled atmosphere glove box ensures the elimination of impurities which over time and under varied environmental conditions may compromise sensor reliability.

Test equipment

Our final qualification and acceptance test procedures (QTP & ATP) include thermal ovens mounted on seismic stations to measure bias, scale factor and alignment capabilities at room temperature and over various temperature cycles; vibration table is used to measure VRE (vibration rectification error) and VIB (vibration induced bias) of our accelerometers under different vibration profiles; centrifuge is used to measure scale factor linearity of the sensor over full sensing scale.
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